|
THERM-A-FORM
Form-In-Place Compounds
THERM-A-FORM™
form-in-place materials are used for heat transfer applications in
electronic component cooling. These flexible elastomer compounds
minimize stress on components. They are available in a range of
kit sizes for both manual and pneumatic dispensing.
S
THERM-A-FORM T642 silicone encapsulant is ideal for
underfilling or other component-level heat transfer applications.
THERM-A-FORM T644/T644G compound is a very low modulus
material for transferring heat from fragile electronic parts.
THERM-A-FORM T646 compound transfers heat from hot
components to heat sinks, PC boards, metal enclosures and chassis.
It combines high thermal conductivity and low cost into an easily
applied solution.
Typical
Applications
Related Products
|
