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Dow Corning® EA-7100 For Electronic & Automotive Applications

Dow Corning® has demonstrated time after time its endearing qualities as a global leader in adhesive silicone adhesive technology and products; the company has done it again with the introduction of its new Dow Corning® EA-7100 Thermal Radical Cure (TRC) Adhesive. With its 2015 nominations for the prestigious R&D 100 Award in both the Market Disrupter category and the Mechanical Devices/Materials category, Dow’s new TRC adhesive promises to offer “game-changing benefits” to its customers in the transportation electronics sector.

car-diagram

Among the potential applications for this breakthrough in adhesive technology are the assembly of electronics housings, the attachment of connectors, electronic control units (ECUs), lighting and display modules, or sensors, to an unprecedented variety of substrates.
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Henkel Adhesives Deliver for Wearable Electronics

From smart watches to user interface glasses, wearable electronics are on the edge of technology allowing consumers to take their smart gadgets on the go. As the demand for mobility rises, devices get smaller and the technology to manufacture them continues to advance and evolve. The rigorous demands of wearable electronics are keeping adhesive technology at the forefront of innovation.

wearable-smart-watches

Henkel Adhesives Provide High-Performance Solutions

Wearable electronics demand requires performance and reliability under the most adverse conditions. Exposure to shock, stress, vibration, extreme temperatures, and water/moisture can’t be allowed to affect performance and reliability. In this rapidly growing market where less is more, there is no place for bulky adhesive products on devices where size and limitations are crucial. Manufacturers of wearable technology depend on Henkel for the adhesive solutions they need to take their complex products from the design table to the production line.
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Robert McKeown Co. Hosts TECHNOMELT™ Workshop

Join us Tuesday, June 28, 2016 at 10 a.m. for a TECHNOMELT™ Low Pressure Molding Adhesive & Technology Workshop featuring LPMS USA and Henkel Electronics.

workshop-invitationAt the workshop, you’ll learn how to cut costs, improve manufacturing efficiency and offer a one-step molding alternative to your customers.

Michael Pierce Henkel will speak on their full line of TECHNOMELT™ materials with focus on the new thermally conductive TC 50 and PA 668 materials. Rob Michael will review the key innovations of their line of low pressure molding equipment and will provide demos with the Beta 600 as well.

The TECHNOMELT™ family of low pressure molding solutions address demanding protection against solvents, moisture and chemicals, high temperatures and adhesion to multiple types of substrates. Henkel’s TECHNOMELT™ materials are fast, simple, and efficient with each molding operation enduring a short cycle time (30-60 seconds) at low pressure.
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Custom Services For High Tech Electronics Assembly

Robert McKeown Company, Inc. prides itself on providing a myriad of custom assistance services and products such as:

We Specialize in Short-Run and Quick Turn-Around!

X-Y Parts Cutter, Clicker Steel Rule Die Cutting, Rotary Die Cutting of custom and standard Electronic Component Assembly Parts, Epoxy Film Adhesives, Gaskets, Thermal Interface Adhesive Parts, EMI/ESD Shields, Dupont™ Kapton® Solder Masking Dots, Conformal Coating Masking Dots, Powder Coating & Painting Masking Dots as well as Pressure Sensitive adhesive backing for Industrial, Electronics, Aerospace, Mechanical, Mil-Aero and Flat Plastic Parts applications.

X.Y. Laser Converting

The X.Y. laser converting system is one of the top systems available. The continuous and automatic device increases as it goes, removing parts from the sheet with almost no material limitations. This system can increase productivity, with defect-free and tool-free cutting. X.Y. laser converting can also eradicate layout limitations and reduce scrap material costs all while reloading jobs in no time and providing a consistent cut-to-print registration.

laser converting
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Loctite Ablestik SSP 2020

LOCTITE introduces ABLESTIK SSP 2020. An Ag-based material that delivers a robust intermetallic bond between targeted surfaces, the substrate and die, via a pressureless or pressure sintering process. This solution, ideal for high power devices, facilitates much higher thermal and electrical conductivity than traditional die attach adhesives and has performance equivalent or better than solder — all while meeting the stringent requirements of lead-free legislation. The technical staff at the Robert McKeown Company is available to assist you with integration of SSP 2020 into your manufacturing process.

LOCTITE ABLESTIK SSP 2020
is a sintering silver paste die attach adhesive designed for devices requiring elevated thermal and electrical conductivity capabilities. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high as 260°C. It is stencil printable and syringe dispensable.
• Ideal for high power devices
• Delivers a robust intermetallic bond between targeted surfaces
• Facilitates much higher thermal and electrical conductivity than traditional die attach adhesives
• Provides strong adhesion
• Compatible with current production equipment, high throughput
• 10x thermal cycle & power cycle performance better than solder

Loctite SP 2020

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Henkel Loctite GC10

Henkel Loctite GC10 is the industry’s first temperature stable solder paste. GC10 is stable at 26.5 degrees Celsius for one year and at temperatures of up to 40 degrees Celsius for one month. This temperature stability provides tremendous benefits throughout the logistics and operations chain.

Click here to download a PDF copy of the Henkel Loctite Game Changer 10 Specifications

In production, Henkel Loctite GC10 offers huge improvements over conventional solder pastes in printed circuit board assembly. As compared to traditional materials which average abandon times from 1 to 4 hours, this halogen-free, lead-free, temperature-stable formula enables abandon time of up to 24 hours and has a startup time of zero. Stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150 degrees C and 200 degrees C, make Henkel Loctite GC10 incomparable among solder pastes. And, GC10’s dependability on the line yields material utilization of over 95%.henkel loctite gc10

By using Henkel Loctite GC10 the Robert McKeown Company offers its customers both process improvements and cost reductions. The temperature stability of this product will eliminate the challenges with shipping and storage. GC10 is setting a new standard for high performance solder materials with improvements in production, higher yields and ultimately better profitability.

For a sample of Henkel Loctite GC10 or to speak with a technical specialist call 800.631.1125 or email sales@robertmckeown.com

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